Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'
It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!
The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that places four vacuum chucks on a sorting table and processes in sequence: chuck surface cleaning, rough grinding, finishing grinding, and polishing, using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands for a wide variety of IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it provides a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.
- Company：ミクロ技研 本社
- Price：Other
